Communication high multilayer board
Description: Product type: High multi-layer boardtexture of material: FR4 S1000-2Application area: Communication servicesLayer number/plate thickness: 18L/3.0mmSurface treatment: immersion goldLine width/spacing: 4/4milMinimum aperture: 0.25mmTechnical features: fine wiring, impedance control, high thickness to diameter ratio, blind buried holes
