High-frequency Circuit Board

Mixed pressure multi-layer board

Description: Product type: Mixed pressure multi-layer boardtexture of material: FR4+Rogers4350BApplication field: High frequency communicationLayer number/plate thickness: 10L/1.6mmSurface treatment: immersion goldLine width/spacing: 4/4milMinimum aperture: 0.2mmTechnical features: special materials, mixed lamination, fine wiring

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